Smartphone Sensors

 These days smartphone use number of sensors. 

Rahul_Introduction

Introduction: Hi, I am glad that you are on my blog. Thanks! I am Rahul Kumar, an Electrical Design Engineer by profession. My hobbies are travelling, running, cooking and old coin collection. I started adding additional hobbies like - reading and writing blogs. My blogs will be on electrical design and upcoming new technologies and my travel experiance. I have been working as electrical design engineer from 2012. I graduated in 2011, holds bachelor degree in electronics and communication engineering. My area of interest is in electronic product design, and holds knee interest in upcoming new technologies and leviaging best from avaliable technologies in hand. To provide best product to enrich human experiance. My Linkedin - @rahulkumar01 

Experience Summary: 

• Currently working as baseband engineer engineer @ Motorola Mobility [Dec2019 – Till Date]. 

 • Responsible for project development from requirement to production phase: system architecture, block diagram, schematic design and circuit analysis. 

• Highly experienced in designing power supplies (LDO, Buck-Boost), Signal Monitoring-Conditioning circuit design, high/low current driver circuit, Voltage/Current monitoring circuit, audio amplifiers and digital circuit design – MCU/GPU, Memory (NOR, eMMC, NAND, DDR), Power management, ADC-DAC converters, watch dog timer, CAN/I2C/LIN/ SPI/Ethernet/USB memory card interfaces and other digital-analog designs. SXM, IPOD, Audio specification for automotive infotainment. 

• Signal Integrity Analysis: Experience in Signal Integrity Analysis i.e. ringing, crosstalk, ground bounce, distortion, signal loss, grounding and power supply noise. 

• Board bring up and debugging of board, environmental/EMI-EMC/Parametric testing, design verification & production validation testing (DV/PV) 

• Design Justification – WCCA, pSpice simulation 

• Reliability Prediction (ITEM TOOL KIT) & DFMEA 

• Knowledge of complete hardware design life cycle. 

• RoHS component selection, Manage & Optimize Bill of Material (BOM). 

• PCB Layout design co-ordination and review 

• Preparing engineering specification document, Test plan, Test setup presentations for the project. 

• Embedded C and Linux Platform for driver programming and understanding (* Basics) 

• Provide hardware support to Software team in board bring up, testing and debugging. 

• Hands on experience in soldering and handling the lab equipment’s. 

• Experience in Thermal Analysis, and Timing Analysis & EMI/EMC aspects of Hardware Product Design. 

Skills 

Domain - Automotive/ Aerospace Platform Telematics ECU design Battery Management 

System: Battery Cell Controller IC (MC33771), Battery Monitoring System (MM9Z1_638) Automotive Infotainment: Renesas - SoC for Car Information System RCar Series / Freescale - PCIMX287DJM4A,NXP - LPC1788FBD208, iMX28 Automotive Body Control Module : Freescale – MPC5748G Other Microcontroller Knowledge - TI – MSP430, Sitra – AM3517, PIC28F Micro-controllers, 8051 microcontroller, 8085 microprocessor. 

Interfaces  - I2C, I2S, SPI, USB2.0/USB3.0, CAN, 10/100 BaseT Ethernet, Memory Interfacing (SDRAM, NAND, NOR, DDR) 

Testing Equipment’s Multimeter, Digital Oscilloscope, Picoscope, Power supply and analyzer, logic analyzer, Signal Analyzer, 515 Audio Analyzer, UXM for LTE/3G Call, GPS Simulator, Thermal Chamber, Function Generator etc. 

Software tools Analysis - MATHCAD, ITEM TOOL KIT, IQFMEA, Pspice PCB - ORCAD 16.5, Allegro PCB Editor, Allegro Physical Viewer Debugging - Flash tool, Calibration tool & Phone tool, QPST, QXDM 

Software – Python, Embedded C, RTOS, UNIX 

Component Engineering - Selection of microcontroller and processor, active and passive components (like Op-Amps ,MOSFETs, Transistors, Regulators, Buffers, Switches, Connectors etc.) based on their electrical, mechanical, availability and cost parameters 

Documentational - MS Office(Word, Excel, Visio, PPT) 

Commercial Projects I did: 

1. Smartphone clamshell (MotoRazr family) -

From Dec 2019 to Dec 2020

- Role: Baseband staff engineer Contribution:  

1. Electrical circuit design for Sensors like- Accelerometer, Gyroscope, Barometer, Proximity, Ambient light, CapSense (SAR), touch sensor. 

2. PCB layout review 

3. Design validation in lab 

4. Support for manufacturing plant issues 

 2. TCU Design Analysis and DV/PV Testing - Sept 2017 till Nov 2019
Contribution: 

1. WCCA – Worst Case Analysis (Using pSpice, Excel, Mathcad ) 

2. Power Supply Testing and Stability analysis 

3. Testing: Design verification and production validation 

4. Design issue resolution – Wakeup circuit, Power amplifier Class – D, Codec, High Side/Low Side Driver, Power Switches 

5. Manufacturing plant EOL/RF/TLC test planning and implementation 

6. Electrical component part change and termination listing and new part selection 

7. Vendor interaction, alternate component selection 

8. Manufacturing plant support for EOL test , time reduction 

9. Cross functional team interaction to debug system level issue and corrective action planning. 

10. Python scripting 

3. Defect Analysis for APX Control System after market - Jun 2016 till Aug 2017
Role : System Engineer (L&T Technology Services) Contribution: 

1. Defect inspection in MMM, GTD and SVM 

2. Report generation on warranty claim and defects 

3. Supporting Hardware and Software Team for root cause analysis 

 4. BDC Project (Body Control Module) -

Jan 2016 to May 2016

Role : Electrical Engineer (L&T Technology Services) Contribution: 1. Worst Case Analysis (MATHCAD tool used) – Door Handler, Wiper Control, Compressor Valve Current Sense, Door Lock Relay, Ethernet Interface, Transponder – immobilizer, Analog Signal Monitoring for various sensors in BDC ( like – Geer Paddle switch, Resistor Coded switch, Fuel Tank sensor and AC temperature sensors) 2. pSpice Simulation for analog circuits 3. Interaction with component supplier and module owner for design violation and solution proposal. 5. 12V and 48V BMS Analysis -

May 2015 to Dec 2015

Role : Electrical Engineer (L&T Technology Services) 

Contribution: 1. Worst Case Analysis (MATHCAD tool used) : CAN Interface, MCU, Relay Coil Driver, Relay Diagnostics, Temperature Measurement, Connectors 2. Circuit Simulation (pSpice OrCAD): Wakeup signal, Relay coil driver, Relay Diagnostics, Cell Temperature Measurement 3. Sneak Path Analysis 4. Reliability Prediction (ITEM Tool Kit) 5. DFMEA (IQFMEA tool) 

6. Digital Multimedia Automotive Infotainment Receiver -

Nov 2013 to March 2015

- Role : Electrical Engineer (L&T Technology Services) 

Contribution: 1. Requirements gathering and worked on HW architecture, Schematics, PCB Layout, Board Testing and debugging for display controller module of the system. 2. Schematic capturing and layout guidelines preparation. 3. Design of LED Driver circuit, Audio codec interface with I.MX28, Power Amplifier design of output 21W for speaker load of 4 Ohms, NAND interface with I.MX28 and LPC1788, Analog circuit – HSD/LSD, CAN Interface, USB Switch design, power supply sequence design and 12V input rail monitoring circuit, Power budget of the module. 4. Performance testing for Audio, USB2.0, Filters, Bluetooth and RF section for the module like THD, SNR. 5. Performed Environmental Tests, Thermal Chamber Tests, ESD Tests for the Module. 6. Client meeting and support for design improvement. 7. Suggested wire harness design modification and per requirement of system. 8. Provide hardware support to the software team for their testing. 9. Production support and successfully delivered the boards to the Client. 10. Maintained a proper Inventory for the entire stocks for the project. 11. Review and support for user manual writer. 12. Worked on Timing Analysis for LCD interface, I2C, I2S and standby timing for system. 13. Power supply module testing (LDO linear regulator, Buck converter) 14. Design documentation and changes in design documented. 15. OrCAD schematic and net list creation. 16. Production support and successfully delivered the Boards to the Client. 17. BOM creation and optimization based on Cost and RoHS. 18. Production Support at Manufacturing Plant in Shenzhen, China 

7. Remote Patient Vital Signs Monitoring -

March 2013 to Oct 2013

- Monitoring of remote patient vital signs such as blood pressure and flow, core temperature, ECG, respiration/heart rate, carbon dioxide (CO2) concentration is crucial for making real-time decisions. Wireless communication solution that seamlessly supports patient mobility and that prioritizes vital signs transmission using Wireless Body Area Networks (WBANs). The device will collect information on WBANs and provide reports to configured electronic device in hospitals and/or on doctor laptops / tablet note book / mobile using Wi -Fi, 3G network. It will be helpful for doctors to immediately start treatment or operation of patient as all the initial reports is available with them. After clinical review doctor can give advice to operate patient remotely. 

Contribution: 1. Schematic design for - Power Supply Design, USB interface, Backlight driver of TFT LCD, UART interface, WLAN, Ethernet, Memory Card (MMC) interface 2. Component selection and DAR 3. BOM Preparation 

8. USB 3.0 Implementation -

July 2012 to Jan 2013

- USB3.0 interface between application processor (Device/Peripheral Board) and host device like PC with USB3.0. Device Boards (design on CYUSB3014, USB 3.0 Super Speed controller). Device board was interfaced with AM3517 Evaluation Board using GPMC interface to read data and transfer that data to host device using Slave FIFO interface method. 

Contribution: 1. Component Selection, Schematic design. 2. Simulation for differential pair of signal (Signal integrity) 3. Hardware Design for USB3.0 device board using CYUSB3014 4. Interface schematic for CYUSB3014 and AM3517EVM Board in slave FIFO mode. 5. PCB Stack up design 6. Firmware Development for AM3517 EVM board for GPMC interfaces, to send data to USB3.0 (Cypress CYUB3014) controller. 7. Code for Character driver on Linux platform

 9. Digital Temperature logger - April 2012 to June 2012 - Device was designed using MSP430F5310 MPU by Texas Instruments. It read temperature using NTC thermistor and display current reading on LCD and log reading in external memory per minute. It can store temperature reading for 48Hrs. This can be retrieved through HyperTerminal. 

 Role : Hardware Engineer (LTTS) 

 Contribution: 1. Schematic design and component selection for: Power Supply, Watch Dog Timer, and External EEPROM memory interface, MPS430 Microcontroller – Clock, ADC Interface, JTAG 2. BOM preparation 3. Review of Layout on allegro tool 4. Software coding for UART, I2C for communication with external memory.